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China can make advanced chips without EUV, but the bill keeps growing — DUV multiple patterning means bigger dies, lower yields, and longer manufacturing times
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Intel becomes the first company to ship high-volume logic chips made with ASML's High NA EUV — select Panther Lake layers on 18A are now dual-qualified for 0.55 NA scanners
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Chinese startup claims photonic chip production without DUV lithography, says nanoimprint process cuts costs by 90%…
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