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ASML looks to increase prices of its Low-NA EUV tools beyond existing productivity-based model — company wants to capture the value of all the advantages its tools offer, not just wafer throughput improvements
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ASML looks to increase prices of its Low-NA EUV tools beyond existing productivity-based model — company wants to capture the value of all the advantages its tools offer, not just wafer throughput improvements

#tomshardware#asml#value#tsmc#million#prices

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 TSMC says panel packaging won't replace CoWoS anytime soon for the largest future AI processors — wafer-level tech can scale to 58 massive dies in one package
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TSMC says panel packaging won't replace CoWoS anytime soon for the largest future AI processors — wafer-level tech can scale to 58 massive dies in one package

TSMC is exploring panel-level packaging and is working on its CoPoS technology, but the company's Kevin Zhang says wafer-level packaging technologies is considerably more advanced than panel-level packaging.

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 Analyzing TSMC's fab expansion roadmap — multi-fab N2 ramp, CoWoS, SoIC, and uncorking bottlenecks
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Analyzing TSMC's fab expansion roadmap — multi-fab N2 ramp, CoWoS, SoIC, and uncorking bottlenecks

TSMC is executing the largest manufacturing expansion in semiconductor industry history that combines simultaneous multi-fab N2 ramps, AI-driven manufacturing optimizations, and massive CoWoS/SoIC packaging capacity expansion to meet increasing demand for…

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 TSMC CEO C.C. Wei says, ‘It will be a long time before we can meet customer demand’ — tells shareholders that he will keep prices stable, refrain from implementing price hikes
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TSMC CEO C.C. Wei says, ‘It will be a long time before we can meet customer demand’ — tells shareholders that he will keep prices stable, refrain from implementing price hikes

#tomshardware#demand#intel#tsmc#says#enough

TSMC says it does not have enough capacity to handle all the demand from AI hyperscalers, with CEO C.C. Wei saying that it will take a long time before it can match customer demand.…

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Leading-edge foundry roadmaps for TSMC, Intel and Samsung — outlining the path to 1.4nm nodes and beyond
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Leading-edge foundry roadmaps for TSMC, Intel and Samsung — outlining the path to 1.4nm nodes and beyond

Tom's Hardware·Anton Shilov·4 months ago
#sLHXB3X1

From Latest from Tom's Hardware: Leading-edge foundry roadmaps for TSMC, Intel and Samsung — outlining the path to 1.4nm nodes and beyond

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Japanese chemical giant JSR expands to Taiwan for EUV photoresist production near TSMC — plant to fill missing…
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Japanese chemical giant JSR expands to Taiwan for EUV photoresist production near TSMC — plant to fill missing…

Tom's Hardware·Luke James·4 months ago
#95DReTqZ
#euv#nvidia#benchmarking#intelarc#tsmc#resist

From Latest from Tom's Hardware: Japanese chemical giant JSR expands to Taiwan for EUV photoresist production near TSMC — plant to fill missing chemical link to scale EUV materials

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The Deployment Company, Back to the 70s, Apple and Intel
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The Deployment Company, Back to the 70s, Apple and Intel

Stratechery by Ben Thompson·4 months ago
#6Tit9jod
#tsmc#apple#openai#companies#article#audio

OpenAI is forming a new company to deploy AI, and the other labs aren’t far behind, reinforcing the thesis that AI’s impact will require top-down implementation. Then, Apple has economi…

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TSMC allocates $20 billion to Arizona expansion — project faces water and labor shortages, complicated by visa…
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TSMC allocates $20 billion to Arizona expansion — project faces water and labor shortages, complicated by visa…

Tom's Hardware·Anton Shilov·4 months ago
#Kg5CfjNw

From Latest from Tom's Hardware: TSMC allocates $20 billion to Arizona expansion — project faces water and labor shortages, complicated by visa rules

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