Meagan Chappell

Nov 03, 2026

For more information, contact Joel W. Sills, Langley Research Center, [email protected] .

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Chip resistors are widely used in NASA projects, yet cases of alumina substrate cracking during environmental testing are rare. Two instances of thick-film chip resistor cracking were observed during thermal cycling after vibration, with fractures occurring across the short axis due to bending. Failure analyses ruled out defective lots and fatigue, identifying board flexure, component orientation, excessive solder, and mounting stresses as contributing factors.…