NVIDIA on Oct. 21, 2026, announced capacity plans with six manufacturing partners covering package substrates, advanced packaging, testing and the optical engines used in co-packaged optics. The partners are Amkor Technology, IBIDEN, King Yuan Electronics (KYEC), Samsung Electro-Mechanics, Siliconware Precision Industries (SPIL) and Unimicron Technology Corporation.

“We are in the midst of the largest infrastructure buildout in human history. Demand is extraordinary. Capacity is the constraint,” Jensen Huang, NVIDIA’s founder and CEO, said in the release, which was issued at GTC Berlin.

The same constraint has shown up elsewhere in the chain. Taiwan Semiconductor Manufacturing Co. said on Oct.…