(Image credit: Future) Samsung displayed its first physical mockup of HBM5 memory at Computex 2026 in Taipei. Tom's Hardware dropped by to see its pairing of the eighth-generation AI memory with a new in-package cooling structure it calls Heat Path Block, or HPB. Just last week, rival SK hynix unveiled its own iHBM thermal design , meaning both companies are now focusing on the same heat bottleneck in the die-to-die interface that connects memory to the processor. Samsung also confirmed that it’ll fab HBM5’s base die on its in-house 2nm process, down from the 4nm node used for HBM4 and HBM4E. Tom's Hardware Premium Roadmaps Rather than letting heat escape outward through the core dies, HPB builds a separate set of thermal pillars that pull heat from inside the stack and carry it to a spreader sitting above or beside the package, according to Samsung at Computex .…