Built with revolutionary “nanostack” 3D chip architecture, IBM’s sub-1 nm chip to propel semiconductor industry forward for the next decade Jun 25, 2026 YORKTOWN HEIGHTS, NY, June 25, 2026 – IBM (NYSE:  IBM ) today unveiled a major semiconductor breakthrough with the introduction of the world’s first sub-1 nanometer (nm) chip technology, featuring a revolutionary transistor architecture at the 0.7 nm, or 7 angstrom node. The achievement marks a landmark moment for an industry facing the physical limits of traditional chip scaling. Semiconductors play critical roles in everything from computing, to appliances, to communication devices, transportation systems, and critical infrastructure. IBM’s new sub-1 nm chip packs nearly 100 billion transistors onto a chip the size of a fingernail, nearly twice the density of IBM’s 2 nm chip, unveiled in 2021.…