(Image credit: Google)

Google plans to use Intel's EMIB-T packaging for its next-generation TPU codenamed Humufish, according to SemiAnalysis . TSMC's portfolio of chip-on-wafer-on-substrate (CoWoS) technologies has become the de facto standard advanced packaging option for nearly all AI and HPC processors made in the industry. Competing offerings are usually considered as secondary solutions if CoWoS is in tight supply, but things are beginning to change.

Google is a long-standing CoWoS customer for TPUs, starting from the Third-Generation TPU, all the way to Google's latest Eighth-Generation TPUs . Assuming that SemiAnalysis's report about Google's decision to move to EMIB-T with its Ninth-Generation TPUs is accurate, it's a big decision for Google, as switching from one advanced packaging technology to another is a complicated endeavor, which involves plenty of changes and unknowns.…