A shareholder photographs sixth-generation high-bandwidth memory (HBM4) and seventh-generation HBM4E chips with a smartphone camera at Samsung Electronics' 57th annual general meeting of shareholders, held in March at the Suwon Convention Center in Yeongtong-gu, Suwon, Gyeonggi Province. Yonhap News Samsung Electronics (005930) is expected to more than double output of its HBM4 family of high-bandwidth memory chips next year, including sixth-generation HBM4 and seventh-generation HBM4E, as the company plans to raise demand for glass carriers by 2.5 times from this year. Glass carriers are glass supports that hold wafers in place while HBM DRAM is thinned. Samsung will increase outsourced cleaning volume for glass carriers, an essential material in HBM production, to 50,000 sheets a month next year from 20,000 sheets a month this year, according to semiconductor industry sources on the 20th.…