(Image credit: Google)

Google has placed an order for Intel to build more than 3 million of its TPUs in 2028 after months of testing Intel's advanced packaging, according to The Information , citing four people familiar with the matter. They claim that Nvidia is evaluating Intel to build a future processor that fuses four GPU dies into one unit, tied to its Feynman architecture due in 2028 , and that SK hynix is testing whether its high-bandwidth memory works reliably with Intel's packaging.

Specifically, SK hynix needs to know whether Intel can run packaging to the standard that AI accelerators demand. TSMC’s CoWoS is the industry-standard process for it and has been oversubscribed for more than two years. Intel’s embedded multi-die interconnect bridge, or EMIB, is the only alternative AI chip makers can realistically qualify at volume before the end of the decade.

Luke James is a freelance writer and journalist.…