(Image credit: TSMC)

TSMC will invest an additional $100 billion in the U.S. to build at least four more chipmaking plants and advanced packaging facilities in Arizona, CEO C.C. Wei announced at the company's second-quarter earnings conference in Taipei on Thursday. The new fabs will produce chips at the 2nm node and below, and the commitment lifts TSMC's total announced U.S. investment to $265 billion, confirming plans that appeared as a market rumor in February . TSMC didn’t attach a timeline, saying the pace of construction will be set by market demand.

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Wei said the money will fund several more logic wafer fabs "for 2-nanometer and below technologies" alongside advanced packaging plants to serve multi-year demand from TSMC's leading U.S. customers. According to a Bloomberg report citing a U.S. official, the expansion takes TSMC's planned U.S.…